REMAKES REMASTERS / 2026.07.24
Intel "Razor Lake-AX" to Pack 700 TOPS of AI Compute
Intel's senior vice president, Cho Min-sung, announced at the Semiconductors Powering Humanoids summit in South Korea that the next-generation "Razor Lake-AX" platform will be a computing powerhouse, featuring 700 TOPS…
Intel's senior vice president, Cho Min-sung, announced at the Semiconductors Powering Humanoids summit in South Korea that the next-generation "Razor Lake-AX" platform will be a computing powerhouse, featuring 700 TOPS of AI compute on die. This means that at INT8/FP8 precision, "Razor Lake-AX" will outperform the current "Panther Lake" mobile chips by 3.88 times, which have a total compute power of 180 TOPS. This represents a significant boost in compute power for the SoC, primarily derived from a large integrated GPU alongside a substantial CPU complex. Earlier reports indicated that the "Razor Lake-AX" iGPU will be available in two versions: one with a 16-core iGPU and a flagship SKU with a 32-core iGPU.
Both of these integrated graphics solutions are expected to be based on Intel's Xe3 graphics IP, currently found in "Panther Lake." This would make "Razor Lake-AX" nearly three times as powerful as the current Arc B390, which powers Intel's PTL lineup. This suggests that "Razor Lake-AX" will be a large package, as the GPU die is reportedly around 162.84 mm². We also learned that Intel plans to reintroduce on-package memory with the upcoming "AX" chip. Although the company initially stated that the Core Ultra 200V "Lunar Lake" was the last design with on-package memory, Intel is reportedly bringing back on-package LPDDR5X/LPDDR6 memory for "Razor Lake-AX." Do note that the image below is simply an illustration. Read full story
Both of these integrated graphics solutions are expected to be based on Intel's Xe3 graphics IP, currently found in "Panther Lake." This would make "Razor Lake-AX" nearly three times as powerful as the current Arc B390, which powers Intel's PTL lineup. This suggests that "Razor Lake-AX" will be a large package, as the GPU die is reportedly around 162.84 mm². We also learned that Intel plans to reintroduce on-package memory with the upcoming "AX" chip. Although the company initially stated that the Core Ultra 200V "Lunar Lake" was the last design with on-package memory, Intel is reportedly bringing back on-package LPDDR5X/LPDDR6 memory for "Razor Lake-AX." Do note that the image below is simply an illustration. Read full story